专利名称：METHOD FOR ENCAPSULATING
ELECTRONIC COMPONENTS ON A WAFER
发明人：Marc Feron,Vincent Jarry,Laurent Barreau申请号：US13649797申请日：20121011
公开号：US20130043586A1公开日：20130221
专利附图：
摘要：A method for encapsulating electronic components, including the steps of:forming, in a first surface of a semiconductor wafer, electronic components; forming, onthe first surface, an interconnection stack including conductive tracks and vias separated
by an insulating material; forming first and second bonding pads on the interconnectionstack; thinning down the wafer, except at least on its contour; filling the thinned-downregion with a first resin layer; arranging at least one first chip on the first bonding padsand forming solder bumps on the second bonding pads; depositing a second resin layercovering the first chips and partially covering the solder bumps; bonding an adhesivestrip on the first resin layer; and scribing the structure into individual chips.
申请人：Marc Feron,Vincent Jarry,Laurent Barreau
地址：Tours FR,La Membrolle Sur Choisille FR,Cinq Mars La Pile FR
国籍：FR,FR,FR
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