BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
Rev. 05 — 2 March 2009
Product data sheet
1.Product profile
1.1General description
Planar passivated SCR (Silicon Controlled Rectifier) in a SOT78 plastic package.
1.2Features and benefits
High reliability
High surge current capability
High thermal cycling performance
1.3Applications
Ignition circuitsMotor control
Protection CircuitsStatic switching
1.4Quick reference data
Table 1.VDRMIT(AV)IT(RMS)
Quick reference
Conditions
Min-half sine wave;
Tmb≤109°C; see Figure 3half sine wave;
Tmb≤109°C; see Figure 1; see Figure 2
VD=12V; Tj=25°C; IT=100mA; see Figure 8
--Typ---Max5007.512
UnitVAA
repetitive peak off-state voltageaverage on-state currentRMS on-state current
SymbolParameter
Static characteristicsIGT
gate trigger current
-2
5
mA
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
2.Pinning information
Table 2.Pin123mb
KAGmb
Pinning informationSymbol
Descriptioncathodeanodegateanode
mb
A
G
sym037Simplified outlineGraphic symbol
K
123
SOT78 (TO-220AB; SC-46)
3.Ordering information
Table 3.Ordering informationType numberPackage
NameDescriptionVersion
BT151-500LTO-220AB; plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead SOT78
SC-46TO-220AB
BT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20092 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
4.Limiting values
Table 4.SymbolVDRMVRRMIT(AV)IT(RMS)dIT/dtIGMPGMTstgTjITSM
Limiting valuesParameter
repetitive peak off-state voltage
repetitive peak reverse voltage
average on-state current
RMS on-state currentrate of rise of on-state current
peak gate currentpeak gate powerstorage temperaturejunction temperaturenon-repetitive peak on-state currentI2t for fusingaverage gate powerpeak reverse gate voltage
In accordance with the Absolute Maximum Rating System (IEC 60134).
Conditions
Min--half sine wave; Tmb≤109°C; see Figure 3half sine wave; Tmb≤109°C; see Figure 1; see Figure 2
IT=20A; IG=50mA; dIG/dt=50mA/µs------40-half sine wave; tp=8.3ms; Tj(init)=25°Chalf sine wave; tp=10ms; Tj(init)=25°C;see
Figure 4; see Figure 5tp=10ms; sine-wave pulseover any 20 ms period
-----Max5005007.5125025150125132120720.55
UnitVVAAA/µsAW°C°CAAA2sWV
I2tPG(AV)VRGM
25IT(RMS)(A)20001aaa95416IT(RMS)(A)12001aaa9991581045010−210−1110surge duration (s)0−50050100Tmb (°C)150Fig 2.Fig 1.RMS on-state current as a function of surge duration; maximum valuesRMS on-state current as a function of mounting base temperature; maximum valuesBT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20093 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
15Ptot(W)1.9104conductionangle(degrees)30609012018000246formfactora42.82.21.91.572.22.8003aab830a = 1.575α8IT(AV) (A)Fig 3.103Total power dissipation as a function of average on-state current; maximum values001aaa956ITSM(A)dlT/dt limit102ITITSMttpTj initial = 25 °C max 1010−510−410−3tp (s)10−2Fig 4.Non-repetitive peak on-state current as a function of pulse width for sinusoidal currents; maximum valuesBT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20094 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
160 ITSM(A)120003aab82980ITITSM40ttpTj initial = 25 °C max0110102number of cycles103Fig 5.Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values5.Thermal characteristics
Table 5.SymbolRth(j-mb)
Thermal characteristicsParameter
Conditions
Min-Typ-Max1.3
UnitK/W
thermal resistance from see Figure 6junction to mounting base
thermal resistance from junction to ambient free air
Rth(j-a)
-60-K/W
10Zth(j-mb)(K/W)001aaa962110−1Pδ =tpT10−2tptT10−310−510−410−310−210−11tp (s)10Fig 6.Transient thermal impedance from junction to mounting base as a function of pulse widthBT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20095 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
6.Characteristics
Table 6.SymbolIGTILIHVTVGT
CharacteristicsParametergate trigger currentlatching currentholding currenton-state voltagegate trigger voltage
Conditions
VD=12V;Tj=25°C;IT=100mA; see Figure 8
VD=12V;Tj=25°C;seeFigure 9VD=12V;Tj=25°C;seeFigure 10IT=23A; Tj=25°C; see Figure 11IT=100mA; VD=12V; Tj=25°C; see Figure 12
IT=100mA; VD=500V; Tj=125°C
IDIRdVD/dt
off-state currentreverse currentrate of rise of off-state voltage
j=125°CVD=500V; T
VR=500V; Tj=125°C
VDM=335V;Tj=125°C; exponential
waveform; gate open circuit
Min-----0.25--50200--Typ21071.40.60.40.10.11301000270
Max540201.751.5-0.50.5----UnitmAmAmAVVVmAmAV/µsV/µsµsµs
Static characteristics
Dynamic characteristics
tgttq
VDM=335V;Tj=125°C;RGK=100Ω; exponential waveform; see Figure 7
G=100mA; gate-controlled turn-on ITM=40A; VD=500V; I
timedIG/dt=5A/µs; Tj=25°Ccommutated turn-off
time
VDM=335V;Tj=125°C;ITM=20A; VR=25V;(dIT/dt)M=30A/µs; dVD/dt=50V/µs; RGK=100Ω
104dVD/dt(V/μs)103(1)001aaa9493IGTIGT(25°C)2001aaa952(2)102110050100Tj (°C)1500−50050100Tj (°C)150Fig 8.Normalized gate trigger current as a function of junction temperatureFig 7.Critical rate of rise of off-state voltage as a function of junction temperature; minimum valuesBT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20096 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
3ILIL(25°C)2001aaa9513IHIH(25°C)2001aaa950110−50050100Tj (°C)1500−50050100Tj (°C)150Fig 9.Normalized latching current as a function of junction temperature30001aaa959Fig 10.Normalized holding current as a function of junction temperature1.6VGTVGT(25°C)1.2001aaa953IT(A)20(1)(2)(3)100.8000.511.5VT (V)20.4−50050100Tj (°C)150Fig 12.Normalized gate trigger voltage as a function of junction temperatureFig 11.On-state current as a function of on-state voltageBT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20097 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
7.Package outline
Plastic single-ended package; heatsink mounted; 1 mounting hole; 3-lead TO-220ABSOT78EpqD1AA1mountingbaseDL1(1)b1(2)L2(1)QL(3×)b2(2)(2×)123b(3×)eec05scale10 mmDIMENSIONS (mm are the original dimensions)UNITmmA4.74.1A11.401.25b0.90.6b1(2)1.61.0b2(2)1.31.0c0.70.4D16.015.2D16.65.9E10.39.7e2.54L15.012.8L1(1)3.302.79L2(1)max.3.0p3.83.5q3.02.7Q2.62.2Notes1. Lead shoulder designs may vary.2. Dimension includes excess dambar.OUTLINEVERSIONSOT78REFERENCESIECJEDEC3-lead TO-220ABJEITASC-46EUROPEANPROJECTIONISSUE DATE08-04-2308-06-13Fig 13.Package outline SOT78 (TO-220AB)
BT151-500L_5
© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20098 of 11
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NXP Semiconductors
BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
8.Revision history
Table 7.
Revision history
Release date20090302
Data sheet statusProduct data sheet
Change notice-SupersedesBT151_SER_L_R_4
Document IDBT151-500L_5Modifications:BT151_SER_L_R_4
••
Package outline updated.
Type number BT151-500L separated from data sheet BT151_SER_L_R_4.
Product data sheetProduct specificationProduct specificationProduct specification
----BT151_SERIES_3BT151_SERIES_2BT151_SERIES_1-
20061023
BT151_SERIES_3 (9397 20040607750 13159)BT151_SERIES_2BT151_SERIES_1
1999060119970901
BT151-500L_5© NXP B.V. 2009. All rights reserved.
Product data sheetRev. 05 — 2 March 20099 of 11
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BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
9.Legal information
9.1
Data sheet status
Product status[3]DevelopmentQualificationProduction
Definition
This document contains data from the objective specification for product development.This document contains data from the preliminary specification.This document contains the product specification.
Document status [1][2]Objective [short] data sheetPreliminary [short] data sheetProduct [short] data sheet
[1][2][3]
Please consult the most recently issued document before initiating or completing a design.The term 'short data sheet' is explained in section \"Definitions\".
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2Definitions
Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
9.3Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information.
Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental
9.4Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
10.Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
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Product data sheetRev. 05 — 2 March 200910 of 11
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11.Contents
1Product profile. . . . . . . . . . . . . . . . . . . . . . . . . . .11.1General description . . . . . . . . . . . . . . . . . . . . . .11.2Features and benefits. . . . . . . . . . . . . . . . . . . . .11.3Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .11.4Quick reference data . . . . . . . . . . . . . . . . . . . . .12Pinning information. . . . . . . . . . . . . . . . . . . . . . .23Ordering information. . . . . . . . . . . . . . . . . . . . . .24Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .35Thermal characteristics . . . . . . . . . . . . . . . . . . .56Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .67Package outline. . . . . . . . . . . . . . . . . . . . . . . . . .88Revision history. . . . . . . . . . . . . . . . . . . . . . . . . .99Legal information. . . . . . . . . . . . . . . . . . . . . . . .109.1Data sheet status . . . . . . . . . . . . . . . . . . . . . . .109.2Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .109.3Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .109.4Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .1010
Contact information. . . . . . . . . . . . . . . . . . . . . .10
BT151-500L
SCR, 12 A, 5mA, 500 V, SOT78
Please be aware that important notices concerning this document and the product(s)described herein, have been included in section ‘Legal information’.
© NXP B.V.2009.All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 2 March 2009Document identifier: BT151-500L_5
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